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 AP4511M
Advanced Power Electronics Corp.
Simple Drive Requirement Low On-resistance Fast Switching Performance
D2 D1 D2 D1 D1 D1 D2 D2
N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET
N-CH BVDSS RDS(ON)
S2 G1 S2 S1 G1 S1 G2 G2
35V 25m 7A -35V 40m -6.1A
SO-8 SO-8
Description
The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and costeffectiveness. The SO-8 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage applications such as DC/DC converters.
ID P-CH BVDSS RDS(ON) ID
D1
D2
G1 S1
G2 S2
Absolute Maximum Ratings
Symbol VDS VGS ID@TA=25 ID@TA=70 IDM PD@TA=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3 3
Rating N-channel 35 20 7 5.7 30 2.0 0.016 -55 to 150 -55 to 150 P-channel -35 20 -6.1 -5 -30
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-a Parameter Thermal Resistance Junction-ambient
3
Value Max. 62.5
Unit /W
Data and specifications subject to change without notice
201122041
AP4511M
N-CH Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
Parameter Drain-Source Breakdown Voltage
Test Conditions VGS=0V, ID=250uA
Min. 35 1 -
Typ. 0.02 18 29 9 11 3 6 12 7 22 6 830 150 110 1.2
Max. Units 25 37 3 1 25 100 18 1330 1.8 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA
RDS(ON)
Static Drain-Source On-Resistance
2
VGS=10V, ID=7A VGS=4.5V, ID=5A
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=70 C)
o o
VDS=VGS, ID=250uA VDS=10V, ID=7A VDS=35V, VGS=0V VDS=28V, VGS=0V VGS=20V ID=7A VDS=28V VGS=4.5V VDS=18V ID=1A RG=3.3,VGS=10V RD=18 VGS=0V VDS=25V f=1.0MHz f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
2
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2 2
Test Conditions IS=1.7A, VGS=0V IS=7A, VGS=0V dI/dt=100A/s
Min. -
Typ. 18 12
Max. Units 1.2 V ns nC
Reverse Recovery Time
Reverse Recovery Charge
AP4511M
P-CH Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
o
Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (T oC) j=25 Drain-Source Leakage Current (T oC) j=70
2
Test Conditions VGS=0V, ID=-250uA VGS=-10V, ID=-6A VGS=-4.5V, ID=-4A VDS=VGS, ID=-250uA VDS=-10V, ID=-6A VDS=-35V, VGS=0V VDS=-28V, VGS=0V VGS=20V ID=-6A VDS=-28V VGS=-4.5V VDS=-18V ID=-1A RG=3.3,VGS=-10V RD=18 VGS=0V VDS=-25V f=1.0MHz f=1.0MHz
Min. -35 -1 -
Typ. -0.02 32 50 9 10 2 6 10 6 26 7 690 165 130 5.2
Max. Units 40 60 -3 -1 -25 100 16 1100 7.8 V V/ m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25,ID=-1mA
RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Rg
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
2
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2 2
Test Conditions IS=-1.7A, VGS=0V IS=-6A, VGS=0V dI/dt=-100A/s
Min. -
Typ. 20 12
Max. Units -1.2 V ns nC
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 135 /W when mounted on Min. copper pad.
AP4511M
N-Channel
50 50
T A = 25 o C
40
10V 7.0V 5.0V
ID , Drain Current (A)
T A = 150 o C
40
10V 7.0V 5.0V
ID , Drain Current (A)
30
30
20
20
10
V G =3.0V
10
V G =3.0V
0 0 1 2 3 4 5
0 0 1 2 3 4 5
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
40
1.8
ID=5A
35
1.6
T A =25 o C Normalized RDS(ON)
1.4
ID=7A V G =10V
RDS(ON) (m )
30
1.2
1.0
25 0.8
20
2 4 6 8 10
0.6 -50 0 50 100 150
V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
1.5
6
5 1.3
4
Normalized VGS(th) (V)
IS(A)
T j =150 o C
3
T j =25 o C
1.1
0.9
2
0.7 1
0 0 0.2 0.4 0.6 0.8 1 1.2
0.5 -50 0 50 100 150
V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
AP4511M
N-Channel
f=1.0MHz
14 1000
C iss
VGS , Gate to Source Voltage (V)
12
I D =7A V DS =28V
10
C oss
8
C (pF)
100
C rss
6
4
2
0 0 5 10 15 20 25
10 1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthja)
Duty factor=0.5
10us
10
02
1ms 10ms
01
0.1
0 05
ID (A)
1
100ms
o
0 02
0 01
PDM 0.01
Si
t T
0.1
T A =25 C Single Pulse
Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja=135o C/W
0.01 0.1 1 10 100
0.001 0.0001 0.001 0.01 0.1 1 10 100 1000
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
30
V DS =5V ID , Drain Current (A) T j =25 o C
20
VG
T j =150 o C
QG 4.5V QGS QGD
10
Charge
0 0 2 4 6 8
Q
V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
AP4511M
P-Channel
50
50
T A = 25 C
40
o
-10V 7 0V
40
T A = 150 C -ID , Drain Current (A)
o
-10V -7.0V
-ID , Drain Current (A)
30
30
20
20
V
10
3 0V
10
V
3 0V
0 0 1 2 3 4 5
0
0 1 2 3 4 5
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
60
1.4
I D = -4 A
55
o T A =25 C
1.2
I D =-6A V G =-10V Normalized R DS(ON)
50
RDS(ON) (m)
45
1.0
40
0.8
35
0.6
30
3 5 7 9 11
-50
0
50
100
150
-V GS ,Gate-to-Source Voltage (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
1.5
6
Normalized -VGS(th) (V)
5
1.3
4
1.1
-IS(A)
3
T j =150 o C
T j =25 o C
0.9
2
0.7 1
0 0 0.2 0.4 0.6 0.8 1 1.2
0.5 -50 0 50 100 150
-V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
AP4511M
P-Channel
f=1.0MHz
14 10000
12
-VGS , Gate to Source Voltage (V)
I D = -6 A V DS = - 28V
10
8
C (pF)
1000
C iss
6
4
C oss
2
C rss
0 0 5 10 15 20 25 100 1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
-V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
10
100us 1ms
Normalized Thermal Response (Rthja)
0.1
-ID (A)
1
10ms 100ms T =25 o C
P DM 0.01
t T
0.1
1s DC
Duty factor = t/T Peak Tj = P DM x Rthja + Ta Rthja=135oC/W
0.01 0.1 1 10 100
0.001 0.0001 0.001 0.01 0.1 1 10 100 1000
-V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
30
V DS =-5V -ID , Drain Current (A) T j =25 o C
20
VG
T j =150 o C
QG -4.5V QGS QGD
10
Charge
0 0 2 4 6 8
Q
-V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform


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